Nanoscale characterization of the thermal interface resistance of a heat-sink composite material by in situ TEM

Nanoscale characterization of the thermal interface resistance of a heat-sink composite material by in situ TEM
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DOI:
10.1088/0957-4484/26/46/465705
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发表时间:
2015-11-20
期刊:
影响因子:
3.5
通讯作者:
Golberg, Dmitri
Golberg, Dmitri
中科院分区:
材料科学3区
文献类型:
--
作者:
Kawamoto, Naoyuki;Kakefuda, Yohei;Golberg, Dmitri

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我们开发了一个原始的方法,利用高分辨率透射电子显微镜(HRTEM)的热阻原位纳米级表征。高分辨透射电子显微镜的聚焦电子束用作非接触热源,并开发了可压电移动的纳米热偶作为热探测器。该方法具有很高的灵活性,为纳米/微米尺度的热导率分析提供热流方向,是一种强有力的方法来探测复杂或复合材料的热性能。使用这种方法,我们进行了可重复的测量电子束引起的温度变化在预先选定的部分的散热器α-Al 2 O 3/环氧树脂基树脂复合材料。在填料中观察到的温度变化的线性行为揭示了傅立叶定律即使在这样的介观尺度下也成立。此外,我们成功地确定了相邻的α-Al 2 O 3填料之间的纳米级界面的热阻为1.16 x 10(-8)m(2)K W-1,这是填料本身的热阻的35倍。我们发现的这种方法能够在纳米级上评估复合材料的热阻率,并结合TEM所需的最终空间定位和分辨率样品分析能力。
We developed an original method of in situ nanoscale characterization of thermal resistance utilizing a high-resolution transmission electron microscope (HRTEM). The focused electron beam of the HRTEM was used as a contact-free heat source and a piezo-movable nanothermocouple was developed as a thermal detector. This method has a high flexibility of supplying thermal-flux directions for nano/microscale thermal conductivity analysis, and is a powerful way to probe the thermal properties of complex or composite materials. Using this method we performed reproducible measurements of electron beam-induced temperature changes in pre-selected sections of a heat-sink alpha-Al2O3/epoxy-based resin composite. Observed linear behavior of the temperature change in a filler reveals that Fourier's law holds even at such a mesoscopic scale. In addition, we successfully determined the thermal resistance of the nanoscale interfaces between neighboring alpha-Al2O3 fillers to be 1.16 x 10(-8) m(2)K W-1, which is 35 times larger than that of the fillers themselves. This method that we have discovered enables evaluation of thermal resistivity of composites on the nanoscale, combined with the ultimate spatial localization and resolution sample analysis capabilities that TEM entails.