Fabrication of multiperiod Si/SiO2 /Ge layered structure through chemical bond manipulation
Fabrication of multiperiod Si/SiO2 /Ge layered structure through chemical bond manipulation
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通过化学键操纵制备多周期Si/SiO2/Ge层状结构
DOI:
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发表时间:
1998
期刊:
影响因子:
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通讯作者:
Y. Masumoto
中科院分区:
文献类型:
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作者:
K. Prabhakaran;T. Matsumoto;T. Ogino;Y. Masumoto
In this letter, we report a method called chemical bond manipulation for fabrication of multiperiod nanometer sized Si/SiO2/Ge layered structure. Chemical bond manipulation is a self-organization process which involves selective breaking and making of surface chemical bonds and thereby enable formation of the desired species on a full wafer scale. We show that oxygen of germanium oxide layer formed on Si(111) are picked up by the Si atoms arriving at the surface during subsequent growth. This phenomenon involves breaking of Ge–O bonds and making of Si–O bonds and leads to the formation of ultrathin Si and Ge layers sandwiched between ultrathin silicon oxide layers, preserving the original wafer morphology. This material exhibits blue-green light emission at room temperature when excited by ultraviolet laser.