High-performance polymers adapted to facile melt processing through structure design of benzocyclobutene-containing precursors
High-performance polymers adapted to facile melt processing through structure design of benzocyclobutene-containing precursors
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通过含苯并环丁烯前体的结构设计，实现易于熔融加工的高性能聚合物
DOI：
10.1016/j.eurpolymj.2021.110445
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发表时间：
2021-04
影响因子：
6
通讯作者：
Wang Changchun
中科院分区：
文献类型：
--
作者：
Jin Ke;Sun Qiangsheng;Feng Yudi;Guo Jia;Wang Changchun
科学家和工程师长期以来一直在探索具有良好加工性和增强性能（更高的热稳定性和机械强度、更高的玻璃化转变温度（Tg）和更低的热膨胀）的高性能聚合物材料。本研究展示了一种新的方法来制造高性能的聚合物，如聚芳酰胺（传统的聚芳酰胺不能通过熔融加工，由于缺乏热分解前的粘流温度），具有优异的加工性能，通过一个简单的两步过程，即低温熔融加工和随后的原位热固化。通过设计含BCB前驱体的结构，可以很好地控制其熔点和固化温度，从而调节聚合物的熔融加工温度和固化温度。在我们的实验中，前体熔点和聚合温度之间的温差可以超过200 °C，提供宽的加工窗口和长的储存寿命。此外，这些前体在有机溶剂中也具有优异的溶解性，这赋予它们溶液或熔融加工的可能性，如代表性前体DODA-BCB所示。所得聚合物树脂膜显示出良好的热稳定性（Td，5%> 410 °C）、高的玻璃化转变温度（Tg> 240 °C）和良好的机械强度（储能模量> 1.8 GPa）。进一步研究了薄膜的热膨胀行为，揭示了p-3，4 ′-ODA-BCB的热收缩特性，并利用DFT计算、VT-FTIR和TMA对薄膜的热收缩机理进行了详细的讨论。
High-performance polymeric materials with good processability and enhanced performance (higher thermal stability and mechanical strength, higher glass transition temperature (Tg) and lowered thermal expansion) have long been explored by scientists and engineers. The present study demonstrated a new way to fabricate high-performance polymers, such as polyarylamide (traditional polyarylamides can’t be processed by melt processing due to the lack of viscous flow temperature before thermal decomposition), with excellent processability via a facile two-step process, i.e. low-temperature melt processing and a subsequent in-situ thermal curing. Through designing the structure of the BCB-containing precursors, we can well control the melting point and curing temperature, thus adjust the melt processing temperature and curing temperature of the polymers. In our experiments, the temperature difference between precursor melting point and polymerization temperature can be over 200 °C, providing wide processing window and long storage lifetime. Besides, these precursors also possess excellent solubility in organic solvents, which endow them with the possibility of solution or melt processing, as illustrated by the representative precursor, DODA-BCB. The obtained polymer resin films show good thermal stability (Td,5%> 410 °C), high glass transition temperatures (Tg> 240 °C) and good mechanical strength (storage modulus > 1.8 GPa). Further studies on the thermal expansion behavior of the films reveal the thermal contracting feature of p-3,4′-ODA-BCB, the mechanism has been discussed in detail using DFT calculations, VT-FTIR and TMA.
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DOI：
10.1002/pola.1988.080260712
发表时间：
1988-07
期刊：
Journal of Polymer Science Part A
影响因子：
--
作者：
Loon-Seng Tan;F. Arnold
通讯作者：
Loon-Seng Tan;F. Arnold
影响因子：
5.5
作者：
K. Walker;L. Markoski;Jeffrey S. Moore
通讯作者：
K. Walker;L. Markoski;Jeffrey S. Moore
高性能耐氯聚酯反渗透海水淡化膜
影响因子：
27.6
作者：
Yao Yujian;Zhang Pingxia;Jiang Chao;DuChanois Ryan M.;Zhang Xuan;Elimelech Menachem
通讯作者：
Elimelech Menachem
影响因子：
4.6
作者：
Bisoi, Soumendu;Mandal, Arun Kumar;Banerjee, Susanta
通讯作者：
Banerjee, Susanta
影响因子：
4.6
作者：
Yuan Song;Jinyan Wang;Guanghui Li;Qingmin Sun;X. Jian;J. Teng;Hongbo Zhang
通讯作者：
Yuan Song;Jinyan Wang;Guanghui Li;Qingmin Sun;X. Jian;J. Teng;Hongbo Zhang