Ferromagnetic Film − Substrate Decoupling for Sensor Applications
Ferromagnetic Film − Substrate Decoupling for Sensor Applications
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传感器应用的铁磁薄膜 â 基板去耦
DOI:
10.1002/adem.201700397
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发表时间:
2017
影响因子:
3.6
通讯作者:
S. Ulrich
中科院分区:
文献类型:
--
作者:
S. Beirle;K. Seemann;H. Leiste;S. Ulrich
This study presents the decoupling of ferromagnetic properties of Fe–Co–Hf–N films with an in‐plane uniaxial anisotropy from ferromagnetic cemented carbide (WC–Co) substrates by predepositing a non‐ferromagnetic buffer layer between the substrate and the film. Due to the ferromagnetic Co content in the substrate, a magnetic coupling effect arises which suppresses the natural ferromagnetic resonance of the Fe32Co45Hf11N12film at a frequency of 2.13 GHz. The deposition of a non‐ferromagnetic, electrically conductive TiN layer, or a non‐ferromagnetic, electrically insulating SiO2layer between the substrate and the soft ferromagnetic film shows decoupling regarding the static ferromagnetic properties, so that the formation of an in‐plane uniaxial anisotropy is possible. With regard to the application as a high‐frequency sensor the paper shows that with increasing the thickness of the electrically insulating SiO2buffer layer the full width at half maximum (FWHM) of the resonance line becomes much sharper, in contrast to the electrically conductive TiN. The explanation was attributed to the formation of eddy‐currents in the electrically conductive material causing a magnetic field which disturbs the uniform precession of the magnetic moments. The high‐frequency properties of the decoupled film system are promising for a thermal and mechanical stress sensor system on cutting tools.
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DOI:
--
发表时间:
2014
期刊:
影响因子:
--
作者:
K. Seemann;K. Krüger;H. Leiste
通讯作者:
H. Leiste
DOI:
--
发表时间:
1937
期刊:
影响因子:
--
作者:
P. Hidnert
通讯作者:
P. Hidnert
DOI:
--
发表时间:
1989
期刊:
影响因子:
--
作者:
A. Gadalla;W. Tsai
通讯作者:
W. Tsai
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
K. Krüger;K. Seemann;H. Leiste;M. Stüber;S. Ulrich
通讯作者:
S. Ulrich
DOI:
--
发表时间:
2016
期刊:
影响因子:
--
作者:
K. Seemann;H. Leiste;M. Stüber;K. Krüger;H. Brunken;A. Ludwig;C. Thede;E. Quandt
通讯作者:
E. Quandt