Experimental investigation on the failure of lead‐free solder joints under drop impact
Experimental investigation on the failure of lead‐free solder joints under drop impact
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DOI：
10.1108/09540911011054172
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发表时间：
2010-06
影响因子：
2
通讯作者：
Fang Liu;G. Meng;Mein Zhao
中科院分区：
文献类型：
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作者：
Fang Liu;G. Meng;Mein Zhao
目的：研究球栅阵列(BGA)无铅焊点在板级跌落冲击下的失效机理。设计/方法/途径-采用圆形测试板。首先，进行了三种不同高度的跌落试验。为了研究无铅焊点在跌落冲击下的失效机理，进行了染料染色试验和金相分析。结果表明，机械冲击和印刷电路板弯曲振动的共同作用是无铅焊点跌落冲击失效的根本原因。另一方面，BGA无铅焊点的断裂发生在封装侧附近的金属间化合物界面，失效模式为脆性断裂。原产地/值-这些结果与JEDEC标准测试板的结果相同。在进行跌落试验时，圆形试验板可以代替JEDEC标准试验板。
Purpose – The purpose of this paper is to investigate the mechanism of ball grid array (BGA) lead‐free solder joint failure under board‐level drop impact.Design/methodology/approach – A round shaped test board was used. First, drop tests at three different heights were carried out. Then, dye stain testing and metallurgical analysis were performed in order to study the failure mechanism of lead‐free solder joints under drop impact.Findings – The test results indicate that the combined effect of mechanical shock and printed circuit board bending vibration is the root cause of solder joint failure under drop impact. On the other hand, the fracture of BGA lead‐free solder joints occurs at the intermetallic compound interface near the package side, and the failure mode is brittle fracture.Originality/value – These results are the same as those for JEDEC standard test boards. The round test board could take the place of the JEDEC standard test board when conducting drop testing.