Effects of silver oxide addition on the electrical resistivity and microstructure of low-temperature-curing metallo-organic decomposition silver pastes
Effects of silver oxide addition on the electrical resistivity and microstructure of low-temperature-curing metallo-organic decomposition silver pastes
复制标题
DOI：
10.1143/jjap.46.4179
复制
发表时间：
2007-07-01
期刊：
影响因子：
--
通讯作者：
Wang, Sea-Fue
中科院分区：
文献类型：
--
作者：
Lu, Chun-An;Lin, Pan;Wang, Sea-Fue
添加金属有机分解（MOD）化合物的银浆料的热分解通常需要大于10分钟的固化时间和大于250 ℃的固化温度，这不满足柔性基板中高速生产的要求。在这项研究中，试图通过用银（I）氧化物（Ag 2 O）和银（II）氧化物（AgO）取代银薄片来修改MOD银浆的固化条件。差热分析（DTA）、微分热重分析（DTG）和X射线衍射（XRD）结果表明，残余银的存在有效地催化了α-松油醇的挥发和2-乙基己酸银的分解，降低了固化温度，缩短了浸泡时间。还原的银和剩余的AgO增强了银薄片的连接性和堆积密度，从而增加了膜的导电性。对于由含有20重量% Ag 2 O或AgO的浆料制备的膜，折射率为14 × 10（-6）和19 × 10（-6）μ Ω中心点cm。在200 ℃下固化5 min后，分别成功地实现。
The thermal decomposition of silver paste with the addition of a metallo-organic decomposition (MOD) compound generally requires a curing time of greater than 10 min and a curing temperature greater than 250 degrees C, which does not meet the requirement for high-speed production in flexible substrates. In this study, attempts to modify the curing conditions of MOD silver pastes through the substitutions of silver flakes with silver(I) oxide (Ag2O) and silver(II) oxide (AgO) were performed. Differential thermal analysis (DTA), derivative thermogravimetric analysis (DTG), and X-ray diffraction (XRD) results indicated that the presence of residual silver oxide, which effectively catalyzes the evaporation of a-terpineol and the decomposition of silver 2-ethyl hexanoate, decreases the curing temperature and shortens the soaking time. The reduced silver and the remaining AgO enhance the connectivity and packing density of the silver flakes, and thus increase the electric conductivity of the films. For films prepared from pastes with 20 wt % Ag2O or AgO, resistivities of 14 x 10(-6) and 19 x 10(-6) mu Omega center dot cm. respectively, were successfully achieved after being cured at 200 degrees C for 5 min.