Higher-Order Topology in Bismuth.
Higher-Order Topology in Bismuth.
复制标题
DOI:
10.1038/s41567-018-0224-7
复制
发表时间:
2018-09-01
期刊:
影响因子:
19.6
通讯作者:
Neupert T
中科院分区:
文献类型:
--
作者:
Schindler F;Wang Z;Vergniory MG;Cook AM;Murani A;Sengupta S;Kasumov AY;Deblock R;Jeon S;Drozdov I;Bouchiat H;Guéron S;Yazdani A;Bernevig BA;Neupert T
The mathematical field of topology has become a framework to describe the low-energy electronic structure of crystalline solids. A typical feature of a bulk insulating three-dimensional topological crystal are conducting two-dimensional surface states. This constitutes the topological bulk-boundary correspondence. Here, we establish that the electronic structure of bismuth, an element consistently described as bulk topologically trivial, is in fact topological and follows a generalized bulk-boundary correspondence of higher-order: not the surfaces of the crystal, but its hinges host topologically protected conducting modes. These hinge modes are protected against localization by time-reversal symmetry locally, and globally by the three-fold rotational symmetry and inversion symmetry of the bismuth crystal. We support our claim theoretically and experimentally. Our theoretical analysis is based on symmetry arguments, topological indices, first-principle calculations, and the recently introduced framework of topological quantum chemistry. We provide supporting evidence from two complementary experimental techniques. With scanning-tunneling spectroscopy, we probe the unique signatures of the rotational symmetry of the one-dimensional states located at step edges of the crystal surface. With Josephson interferometry, we demonstrate their universal topological contribution to the electronic transport. Our work establishes bismuth as a higher-order topological insulator.
登录
查看更多内容
影响因子:
56.9
作者:
Bernevig, B. Andrei;Hughes, Taylor L.;Zhang, Shou-Cheng
通讯作者:
Zhang, Shou-Cheng
影响因子:
3.7
作者:
Hobbs, D;Kresse, G;Hafner, J
通讯作者:
Hafner, J
影响因子:
19.6
作者:
Drozdov, Ilya K.;Alexandradinata, A.;Yazdani, Ali
通讯作者:
Yazdani, Ali
影响因子:
8.6
作者:
Bernevig, BA;Zhang, SC
通讯作者:
Zhang, SC
影响因子:
3.7
作者:
Geier, Max;Trifunovic, Luka;Brouwer, Piet W.
通讯作者:
Brouwer, Piet W.