Enhanced physicochemical properties of polydimethylsiloxane based microfluidic devices and thin films by incorporating synthetic micro-diamond.

Enhanced physicochemical properties of polydimethylsiloxane based microfluidic devices and thin films by incorporating synthetic micro-diamond.
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DOI:
10.1038/s41598-017-15408-3
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发表时间:
2017-11-08
期刊:
影响因子:
4.6
通讯作者:
Paull B
Paull B
中科院分区:
综合性期刊3区
文献类型:
--
作者:
Waheed S;Cabot JM;Macdonald NP;Kalsoom U;Farajikhah S;Innis PC;Nesterenko PN;Lewis TW;Breadmore MC;Paull B

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采用间接3D打印和自旋镀膜技术制备了合成微金刚石-聚二甲基硅氧烷(PDMS)复合微流控芯片和薄膜。微流控芯片含有高达60%的微金刚石成功铸造和粘合。研究了薄片和薄膜的物理化学性质,包括分散模式、疏水性、化学结构、弹性和热特性。扫描电子显微镜显示,微金刚石颗粒嵌入并相互连接在铸造微流控芯片的块状材料中,而在薄膜的情况下,它们在聚合物表面的存在增加导致复合材料的疏水性降低。弹性模量从PDMS控制的1.28增加到60% wt%复合材料的4.42 MPa,导热系数从0.15增加到0.45 W m−1 K−1,增加了三倍。在流体芯片内,微金刚石的掺入通过将通道内的热量有效地传递到周围的衬底来增强散热。在流速为1000 μL/min时,60% wt%的复合芯片的梯度相当于在3 cm长的通道上下降9.8°C,是PDMS控制芯片的两倍多。
Synthetic micro-diamond-polydimethylsiloxane (PDMS) composite microfluidic chips and thin films were produced using indirect 3D printing and spin coating fabrication techniques. Microfluidic chips containing up to 60 wt% micro-diamond were successfully cast and bonded. Physicochemical properties, including the dispersion pattern, hydrophobicity, chemical structure, elasticity and thermal characteristics of both chip and films were investigated. Scanning electron microscopy indicated that the micro-diamond particles were embedded and interconnected within the bulk material of the cast microfluidic chip, whereas in the case of thin films their increased presence at the polymer surface resulted in a reduced hydrophobicity of the composite. The elastic modulus increased from 1.28 for a PDMS control, to 4.42 MPa for the 60 wt% composite, along with a three-fold increase in thermal conductivity, from 0.15 to 0.45 W m−1 K−1. Within the fluidic chips, micro-diamond incorporation enhanced heat dissipation by efficient transfer of heat from within the channels to the surrounding substrate. At a flow rate of 1000 μL/min, the gradient achieved for the 60 wt% composite chip equalled a 9.8 °C drop across a 3 cm long channel, more than twice that observed with the PDMS control chip.