Simultaneous fabrication of nanogap gold electrodes by electroless gold plating using a common medical liquid
Simultaneous fabrication of nanogap gold electrodes by electroless gold plating using a common medical liquid
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DOI：
10.1063/1.2805035
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发表时间：
2007-11-12
影响因子：
4
通讯作者：
Majima, Yutaka
中科院分区：
文献类型：
--
作者：
Yasutake, Yuhsuke;Kono, Keijiro;Majima, Yutaka
报道了一种简单、高产率的同时制备多个纳米间隙的化学镀金方法，该方法采用化学镀金溶液，该溶液由碘酊和L（+）-抗坏血酸（维生素C）组成。通过将金选择性地沉积到金电极的表面上来减小SiO2/Si衬底上的金电极之间的距离（平均33 nm）。通过化学镀金，我们制作了宽度小于5 nm的纳米间隙，工艺产率为41%。我们还证明了库仑阻塞效应在辛烷乙撑（C8）保护的Au纳米粒子通过使用这样一个制造的纳米间隙。(c)2007年，美国物理学会。
We report a simple and high yield method for fabricating multiple nanogaps simultaneously by an electroless gold plating technique using electroless gold plating solution which consists of common medical liquid of iodine tincture and L(+)-ascorbic acid (vitamin C). The distance between the gold electrodes (33 nm in average) on the SiO2/Si substrate was decreased by selective deposition of gold onto the surface of the gold electrodes. By electroless gold plating, we fabricated nanogaps below 5 nm in width with a 41% process yield. We also demonstrated the Coulomb blockade effect in octanethiol(C8)-protected Au nanoparticles by using such a fabricated nanogap. (c) 2007 American Institute of Physics.