Concepts for high packaging and integration efficiency
Concepts for high packaging and integration efficiency
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高封装和集成效率的概念
DOI：
10.1109/pesc.2004.1354740
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
J. Ferreira
中科院分区：
文献类型：
--
作者：
J. Popovic;J. Ferreira
当前电力电子封装技术是基于组装预制的分立元件。每个组件都由许多部件组成，在各种制造工艺中制造。这导致了典型的电力电子转换器中不同部件的多样性和相互不兼容的制造工艺，并且将电力电子技术带到了边缘，在边缘处，降低电力电子转换器的成本和尺寸变得极其困难。本文提出了一种通过提高集成度和采用多功能结构件来改善电力电子变换器封装的方法。介绍了用于评价功率变换器集成度的两个量K/sub l/和K/sub p/。基于这些值，提出了一些提高集成度的方法。然后将这些方法应用于汽车应用的DC/DC 42/14 V转换器。提出了引线框架转换器、PCB嵌入式转换器和导热体转换器三种封装概念。他们相比，在传统的离散封装技术中实现的基准转换器。它表明，通过巧妙地使用的转换器结构中的部分，可以实现高的集成度和高功率密度的值。
Current packaging technology in power electronics is based on assembling pre-manufactured discrete components. Each component consists of a number of parts, manufactured in a variety of manufacturing processes. This has resulted in a diversity of different parts and mutually incompatible manufacturing processes in a typical power electronic converter and has brought power electronics to the edge where it becomes extremely difficult to reduce the cost and size of power electronic converters. In this paper, we present a way to improve packaging of power electronic converters by increasing integration level and using multifunctional construction parts. Two quantities (K/sub l/ and K/sub p/) intended to evaluate integration level in power converters are introduced. Based on these values, a number of methods to increase the integration level are presented. These methods are then applied to a DC/DC 42/14 V converter for automotive applications. Three packaging concepts, namely lead frame converter, PCB embedded converter and heat conductor converter are proposed. They are compared to a benchmark converter implemented in the conventional discrete packaging technology. It is shown that by smart use of parts in the converter construction, the high values of integration level and high power densities can be achieved.