Machining parameter optimization of C/SiC composites using high power picosecond laser
Machining parameter optimization of C/SiC composites using high power picosecond laser
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DOI：
10.1016/j.apsusc.2015.01.010
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发表时间：
2015-03
影响因子：
6.7
通讯作者：
Ruoheng Zhang;Wei-nan Li;Yongsheng Liu;Chunhui Wang;Jing Wang;Xiaojun Yang;Lai-fei Cheng
中科院分区：
文献类型：
--
作者：
Ruoheng Zhang;Wei-nan Li;Yongsheng Liu;Chunhui Wang;Jing Wang;Xiaojun Yang;Lai-fei Cheng
皮秒激光是一种重要的高硬度材料加工技术。采用高功率皮秒激光在C/SiC复合材料上加工微孔，研究了螺旋线宽度、间距、加工时间和扫描速度等工艺参数对微孔加工的影响。采用扫描电子显微镜（SEM）分析了孔的表面形貌，采用能谱仪（EDS）和X射线光电能谱仪（XPS）分析了激光处理前后孔的元素组成变化。实验结果表明，上述参数对微孔的形状、深度等质量有显著影响。此外，在加工表面上观察到由C、Si和O组成的碎屑。SiC基体的Sisingle键C键经机械加工后转变为Sisingle键O键。此外，还讨论了碎片形成的物理过程。
Picosecond laser is an important machining technology for high hardness materials. In this paper, high power picosecond laser was utilized to drill micro-holes in C/SiC composites, and the effects of different processing parameters including the helical line width and spacing, machining time and scanning speed were discussed. To characterize the qualities of machined holes, scanning electron microscope (SEM) was used to analyze the surface morphology, energy dispersive spectroscopy (EDS) and X-ray photoelectric spectroscopy (XPS) were employed to describe the element composition change between the untreated and laser-treated area. The experimental results indicated that all parameters mentioned above had remarkable effects on the qualities of micro-holes such as shape and depth. Additionally, the debris consisted of C, Si and O was observed on the machined surface. The Sisingle bondC bonds of the SiC matrix transformed into Sisingle bondO bonds after machined. Furthermore, the physical process responsible for the mechanism of debris formation was discussed as well.