Wafer-level Variation Modeling for Multi-site RF IC Testing via Hierarchical Gaussian Process
Wafer-level Variation Modeling for Multi-site RF IC Testing via Hierarchical Gaussian Process
复制标题
通过分层高斯过程进行多站点 RF IC 测试的晶圆级变异建模
DOI:
10.1109/itc50571.2021.00018
复制
发表时间:
2021
期刊:
影响因子:
--
通讯作者:
M. Inoue
中科院分区:
文献类型:
--
作者:
Michihiro Shintani;Riaz;Tomoki Nakamura;Masuo Kajiyama;Makoto Eiki;M. Inoue
Wafer-level performance prediction has been attracting attention to reduce measurement costs without compromising test quality in production tests. Although several efficient methods have been proposed, the site-to-site variation, which is often observed in multi-site testing for radio frequency circuits, has not yet been sufficiently addressed. In this paper, we propose a wafer-level performance prediction method for multi-site testing that can consider the site-to-site variation. The proposed method is based on the Gaussian process, which is widely used for wafer-level spatial correlation modeling, improving the prediction accuracy by extending hierarchical modeling to exploit the test site information provided by test engineers. In addition, we propose an active test-site sampling method to maximize measurement cost reduction. Through experiments using industrial production test data, we demonstrate that the proposed method can reduce the estimation error to 1/19 of that obtained using a conventional method. Moreover, we demonstrate that the proposed sampling method can reduce the number of the measurements by 97% while achieving sufficient estimation accuracy.
DOI:
10.1111/j.2517-6161.1977.tb01600.x
发表时间:
1977-01-01
期刊:
JOURNAL OF THE ROYAL STATISTICAL SOCIETY SERIES B-METHODOLOGICAL
影响因子:
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作者:
DEMPSTER, AP;LAIRD, NM;RUBIN, DB
通讯作者:
RUBIN, DB