Cascaded Microresonator-Based Matrix Switch for Silicon On-Chip Optical Interconnection
Cascaded Microresonator-Based Matrix Switch for Silicon On-Chip Optical Interconnection
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DOI：
10.1109/jproc.2009.2014884
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发表时间：
2009-07-01
影响因子：
20.6
通讯作者：
Chen, Hui
中科院分区：
文献类型：
--
作者：
Poon, Andrew W.;Luo, Xianshu;Chen, Hui
本文回顾了在多核计算应用中硅光子互连网络的级联微孔子基质开关中的发展。具体而言，我们强调了我们最近提出的5 x 5矩阵开关，其中包括基于二维级联的微孔谐振器基于硅芯片上的波导交叉网格。交叉网格采用低损坏的低刺串多模数开关的波导交叉口。这样的基于微孔子的矩阵开关提供了多个输入和多个输出之间的非块互连，其关键优点为i）数十亿至数百微米尺度的足迹，ii）千兆位/第二级数据传输，iii）nanosecond速度电路 - 编织，iv）100-mu W尺寸直流功耗每个链接，v）大规模集成网络上的网络应用程序。我们在建议的5 x 5矩阵开关的背景下详细分析了高数据速率信号传输的基于微区谐振器的跨网格开关设计。我们还研究了矩阵开关大规模整合的可行性。我们报告了单个跨网格开关元件和2 x 2矩阵开关的概念验证实验，提出了设计指南，并讨论了未来的工程挑战。
This paper reviews developments in cascaded microresonator-based matrix switches for silicon photonic interconnection networks in many-core computing applications. Specifically, we emphasize our recently proposed 5 X 5 matrix switch comprising two-dimensionally cascaded microring resonator-based electrooptic switches coupled to a waveguide cross-grid on a silicon chip. The cross-grid adopts low-loss low-crosstalk multimode-interference-based waveguide crossings. Such a microresonator-based matrix switch offers nonblocking interconnections among multiple inputs and multiple outputs, with the key merits of i) a tens to hundreds of micrometers-scale footprint, ii) gigabit/second-scale data transmission, iii) nanosecond-speed circuit-switching, iv) 100-mu W-scale dc power consumption per link, and v) large-scale integration for networks-on-chips applications. we analyze in detail the microring resonator-based cross-grid switch design for high-data-rate signal transmission in the context of our proposed 5 x 5 matrix switch. We also study the feasibility of large-scale integration of the matrix switch. we report proof-of-concept experiments of a single cross-grid switch element and a 2 x 2 matrix switch, propose design guidelines, and discuss future engineering challenges.