Analysis of chip size distribution using image processing technology to estimate wear state of cylindrical grinding wheel
Analysis of chip size distribution using image processing technology to estimate wear state of cylindrical grinding wheel
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DOI：
10.1016/j.triboint.2020.106600
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发表时间：
2021
影响因子：
6.2
通讯作者：
Takehito Yoshida;H. Karasawa;R. Fukui;Kohei Fujii;S. Warisawa
中科院分区：
文献类型：
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作者：
Takehito Yoshida;H. Karasawa;R. Fukui;Kohei Fujii;S. Warisawa
理论上，无论是平面磨削还是外圆磨削，切屑形状分布都会随着砂轮磨损而变化。然而，在任何磨削工艺下，切屑形状分布与磨损之间的关系尚未得到实验和定量验证。为此，在这项工作中，从重复的外圆磨削过程中收集的芯片。应注意，工件表面随着每次重复变得更粗糙。使用粒子跟踪系统获得的单个芯片的图像进行了分析，结果表明，小芯片和细长芯片的比例，分别被称为熔融和流动芯片，增加时，砂轮磨损，这是在对比的影响，建立的理论。
In theory, the chip shape distribution changes with the wearing of a grinding wheel in both sur-face and cylindrical grinding processes. However, the relationship between the chip shape distri- bution and wear has not been verified experimentally and quantitatively under any of the grinding techniques. To this end, in this work, chips from repeated cylindrical grinding processes are col-lected. It is noted that the workpiece surface becomes rougher with each repetition. The images of the individual chips, obtained using a particle tracking system are analyzed, and the results indicate that the proportion of small chips and slender chips, respectively known as melted and flow chips, increases when the grinding wheel is worn, which is in contrast to the implications of the established theory.