Formation of quasi-single-domain 3C-SiC on nominally on-axis Si(001) substrate using organosilane buffer layer
Formation of quasi-single-domain 3C-SiC on nominally on-axis Si(001) substrate using organosilane buffer layer
复制标题
使用有机硅烷缓冲层在标称同轴 Si(001) 衬底上形成准单畴 3C-SiC
DOI:
10.1063/1.1564861
复制
发表时间:
2003
影响因子:
3.2
通讯作者:
M. Suemitsu
中科院分区:
文献类型:
--
作者:
H. Nakazawa;M. Suemitsu
Quasi-single-domain 3C-SiC films have been successfully grown on nominally on-axis Si(001) substrate. The starting surface is either of 2×1 quasi-single-domain or of 2×1+1×2 double-domain. The point here is to use dc-resistive heating of the substrate and to form a low-temperature (650 °C) interfacial buffer layer using monomethylsilane (H3 C-SiH3). The dc resistive heating serves to form a single-domain Si(001)-2×1 or 1×2 starting surface or to develop a single-domain 3C-SiC(001)-2×3 or 3×2 surface on a 2×1+1×2 double-domain Si(001) substrate. When a single-domain Si(001) starting surface is utilized, it is not the dc polarity during growth but the surface reconstruction of the starting surface that determines the dominant domain in the 3C-SiC film. The thickness of the single-domain 3C-SiC film is as thin as ∼45–200 nm, which is about three orders of magnitude smaller than that required in a previous study (>5 μm).