Fatigue Testing of Polycrystalline Silicon Thin-film Membrane Using Out-of-plane Bending Vibration
Fatigue Testing of Polycrystalline Silicon Thin-film Membrane Using Out-of-plane Bending Vibration
复制标题
利用面外弯曲振动进行多晶硅薄膜疲劳测试
DOI：
10.1143/jjap.51.11pa02
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发表时间：
2012
影响因子：
1.5
通讯作者：
Osamu Tabata
中科院分区：
文献类型：
--
作者：
Tomoki Tanemura;Shuichi Yamashita;Hiroyuki Wado;Yukihiro;Takeuchi;Toshiyuki Tsuchiya;Osamu Tabata
本文介绍了一种新的多晶硅(多晶硅)薄膜的疲劳试验方法，以评估其机械可靠性而不受腐蚀侧壁表面粗糙度的影响。试件是由多晶硅、二氧化硅和氮化硅薄膜组成的薄膜，中间有圆形重量，外缘由方形框架支撑。用于疲劳试验的多晶硅的应力是通过使重量在共振频率附近沿平面外方向摆动而产生的薄膜的变形来施加的。多晶硅薄膜由于循环应力积累的疲劳损伤而断裂。在威布尔统计和巴黎定律的基础上，很好地绘制了应力和断裂循环次数(S-N)图。250 nm厚多晶硅薄膜的威布尔模数和疲劳指数分别为19.2和21.8。这些参数使得预测多晶硅薄膜在任意循环应力下的寿命成为可能。
This paper describes a new fatigue testing method for polycrystalline-silicon (polysilicon) thin-film membrane to evaluate its mechanical reliability not affected by surface roughness of etched sidewalls. The test specimen is a thin membrane consisting of polysilicon, silicon dioxide, and silicon nitride films with a circular weight at the center, and its outer edge is supported by a square frame. Stress on polysilicon for fatigue test is applied by deformation of the membrane generated by oscillating the weight in the out-of-plane direction near the resonant frequency. The polysilicon film fractured by fatigue damage accumulated by the cyclic stress. Stress and number of cycles to fracture (S–N) plots were well formulated on the basis of Weibull statistics and Paris' law. Weibull modulus and fatigue index of the 250-nm-thick polysilicon film were 19.2 and 21.8, respectively. These parameters make it possible to predict the lifetime of polysilicon thin-film membrane under arbitrary cyclic stress.