A novel THz-enhanced dipole antenna using second-order high impedance surface resonance for MM imaging and sensing
A novel THz-enhanced dipole antenna using second-order high impedance surface resonance for MM imaging and sensing
复制标题
一种新型太赫兹增强偶极子天线，利用二阶高阻抗表面谐振进行多模成像和传感
DOI：
--
复制
发表时间：
2014
期刊：
影响因子：
--
通讯作者：
C. Person
中科院分区：
文献类型：
--
作者：
G. Mikhail;Y. Quéré;C. Quendo;C. Person
本文提出了一种改进的技术，以提高太赫兹（THz）和毫米波（MMW）的片上天线的性能在低阻硅基板上使用高阻抗表面（HIS）。这些表面直接印刷在意法半导体的BiCMOS 55 nm技术后端线（BEOL）的金属层上，不需要任何特殊的后处理（微加工、硅通孔（TSV）等）。它们在增益和效率方面提供了显著的改进。例如，在60 GHz的集成偶极天线的增益提高了7 dBi，并获得40%的效率，而没有HIS的基本偶极天线的效率为23%。此外，由于硅衬底的固定高度引起的频率限制，利用HIS的高阶谐振来增强在较高频率下的性能。HIS的二阶谐振利用毫米波成像应用的220 GHz天线。因此，增益提升了15 dBi的量级。
In this paper, an improved technique is presented to enhance Terahertz (THz) and Millimeter Wave (MMW) On-Chip antenna performance on low-resistive silicon substrates using High-Impedance Surfaces (HIS). These surfaces are directly printed onto the metal layers of ST Microelectronics' BiCMOS 55 nm technology Back End Of Line (BEOL) and do not require any special post-process (micromachining, Through Silicon Vias (TSV), etc.). They provide a remarkable improvement in terms of gain and efficiency. For example, the gain of an integrated dipole antenna at 60 GHz is improved by 7 dBi, and 40% efficiency is obtained, against 23% for the basic dipole without HIS. Furthermore, due to the frequency limitations induced by the fixed height of the silicon substrate, higher-order resonances of HIS are exploited to enhance performance at higher frequencies. The second-order resonance of an HIS is exploited with a 220-GHz antenna for millimeter-wave imaging applications. Thus, the gain is upgraded by the order of 15 dBi.