Rapid dendritic growth and solute trapping within undercooled ternary Ni-5%Cu-5%Mo alloy
Rapid dendritic growth and solute trapping within undercooled ternary Ni-5%Cu-5%Mo alloy
复制标题
快速%20枝晶%20生长%20和%20溶质%20俘获%20内%20过冷%20三元%20Ni-5%Cu-5%Mo%20合金
DOI：
10.1007/s00339-012-7017-0
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发表时间：
2012-10-01
影响因子：
2.7
通讯作者：
Wei, B.
中科院分区：
文献类型：
--
作者：
Chang, J.;Wang, H. P.;Wei, B.
研究了三元Ni-5%Cu-5%Mo合金非平衡凝固过程中α-Ni相枝晶生长速度与过冷度的关系。在实验最大过冷度为308 K（0.17T（L））时，枝晶生长速度达到32 m/s。随着过冷度的增加，枝晶向等轴晶转变。此外，高的枝晶生长速度导致Cu和Mo元素的显著溶质捕获，并且在最大过冷度下实现了几乎无偏析的凝固。
The dendritic growth velocity of alpha-Ni phase was measured as a function of undercooling in the nonequilibrium solidification process of an undercooled ternary Ni-5%Cu-5%Mo alloy. At the experimental maximum undercooling of 308 K (0.17T (L)), the dendritic growth velocity attains 32 m/s. With the increase of undercooling, a morphological transition from dendrites into equiaxed grains occurs. Furthermore, the high dendritic growth velocity leads to the significant solute trapping of Cu and Mo elements and almost segregationless solidification is realized at the maximum undercooling.