Impulsive force phenomenon of electric field stress causing serious particle contamination in plasma etching equipment
Impulsive force phenomenon of electric field stress causing serious particle contamination in plasma etching equipment
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DOI：
10.7567/jjap.53.110308
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发表时间：
2014-10
影响因子：
1.5
通讯作者：
Y. Kasashima;F. Uesugi
中科院分区：
文献类型：
--
作者：
Y. Kasashima;F. Uesugi
为了证明电场应力作为脉冲力，使用标准粒子研究了应力的作用。使用原位颗粒监测系统观察由于电场应力而从基底漂浮的颗粒。结果表明，电场变化越快，应力增加得越多，这体现了电场应力的冲击力效应。根据本研究的结果，我们可以得出结论，等离子蚀刻室中瞬间产生许多片状颗粒的原因是电场应力作为脉冲力起作用。
To demonstrate electric field stress acting as an impulsive force, the action of the stress is investigated using a standard particle. Particles floated from a substrate owing to electric field stress are observed using an in situ particle monitoring system. The results indicate that the more rapidly an electric field changes, the more the stress increases, which demonstrates the impulsive force effect of electric field stress. From the results of this study, we can conclude that the cause of the instantaneous generation of many flaked particles in plasma etching chambers is electric field stress working as an impulsive force.