Ultrasonic bonding of Zr55Cu30Ni5Al10 metallic glass
Ultrasonic bonding of Zr55Cu30Ni5Al10 metallic glass
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DOI：
10.1016/j.mseb.2007.09.028
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发表时间：
2008-02-25
影响因子：
3.6
通讯作者：
Inoue, Akihisa
中科院分区：
文献类型：
--
作者：
Maeda, Masakatsu;Takahashi, Yasuo;Inoue, Akihisa
本研究估计了超声波键合技术将Zr55Cu30Ni5Al10金属玻璃键合在一起的可行性。在没有外部热的情况下，以及在辅助外部热的情况下，粘接一直受到挑战。结果表明，金属玻璃箔在没有外界加热的情况下也能粘结。虽然由于粘接面积的比例不足，导致键的强度较低，但键成功形成，保持了玻璃状结构。采用外热为423 K的键合条件可增大合金的粘附面积，该温度仍低于Zr55Cu30Ni5Al10金属玻璃合金的玻璃化转变温度。(C) 2007 Elsevier B.V.版权所有
The present study estimates the feasibility of ultrasonic bonding technique to bond Zr55Cu30Ni5Al10 metallic glass to each other. Bonding without external heat has been challenged, as well as that with assisting external heat. The results indicate that the metallic glass foils can be bonded even under the condition without external heat. Although the strength of the bonds is low due to the insufficient fraction of adhered area, the bonds are successfully formed retaining the glassy structure. The adhered area can be increased by employing the bonding condition with an external heat up to 423 K, which is still lower than the glass transition temperature of the Zr55Cu30Ni5Al10 metallic glass alloy. (C) 2007 Elsevier B.V. All rights reserved.