Formation mechanisms of Ti 2 AlC MAX phase on SiC-4H using magnetron sputtering and post-annealing
Formation mechanisms of Ti 2 AlC MAX phase on SiC-4H using magnetron sputtering and post-annealing
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DOI:
10.1016/j.matdes.2018.02.046
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发表时间:
2018-04
影响因子:
8.4
通讯作者:
J. Nicolaï;C. Furgeaud;B. W. Fonrose;C. Bail;M. Beaufort
中科院分区:
文献类型:
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作者:
J. Nicolaï;C. Furgeaud;B. W. Fonrose;C. Bail;M. Beaufort
In the present work we focus on the mechanisms involved in Ti2AlC MAX phase thin-film formation. The TiAl2thin-film was deposited by magnetron sputtering on a SiC-4H [0001] substrate. Samples were annealed at various temperatures (700–800 °C) for various times and analysed by XRD and TEM. The epitaxial Ti2AlC phase was formed as follows: [0001]MAX//[0001]SiCand (11−20)MAX//(11–20)SiCwhich is in a good agreement with thermodynamic considerations. The presence of TiC structures at the interface indicates that the formation of this structure is necessary to obtain Ti2AlC. Moreover, the formation of a liquid AlSi alloy was highlighted due to the interdiffusion of Al and Si respectively from TiAl2and SiC during TiC formation. Finally, we assume that, during the cooling, the AlSi alloy separates and Al diffuses to the surface of the TiAl2layer leading to the formation of an Al-rich layer. The remaining Si reacts with Ti from TiAl2to form a Ti5Si3layer following this epitaxial relation: [0001]Ti2AlC//[0001]Ti5Si3and (11–20)Ti2AlC//(3−210)Ti5Si3. These mechanisms lead to the stacking of four different layers. Between 700 and 800 °C, the nature of the formation mechanism is not time-dependent. However, the kinetics of the reactions are both temperature and time dependent.