Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates
Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates
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DOI：
10.1063/1.1530362
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发表时间：
2003-01-15
影响因子：
3.2
通讯作者：
Alford, TL
中科院分区：
文献类型：
--
作者：
Gadre, KS;Alford, TL
铜膜和银膜正被考虑用于未来的多层互连系统。特征尺寸的减小还要求使用不同的低介电性材料(例如，对二甲苯)来代替传统的二氧化硅基层。这些材料之间的粘合是设备可靠和耐用性能的主要障碍。接触角测量用来测量铜层和银层在SiO_2和PaN衬底上的附着能。定性的胶带测试分析表明，这些薄膜经过退火热处理和等离子体处理后，附着力有所提高。用固着水滴法证明了氧等离子体处理提高了对二甲苯的表面能。Ag/PA-n体系附着力的提高归因于表面粗糙度的增加和表面上的羰基的存在。对接触角测量进行了修正，以补偿粗糙度的影响。经等离子体处理后，Ag/pa-n体系的附着能从0.33 N/m增加到1.28 N/m。与银相比，铜在室温下的较高表面能归因于较高的铜附着能。(C)2003年美国物理研究所。
Copper and silver films are being considered for future multilevel interconnect systems. The reduction of feature size has also demanded the use of different low-dielectric materials (e.g., parylenes) in place of conventional silicon dioxide based layers. Adhesion of these materials with each other is a major hurdle in the reliable and durable performance of the devices. Contact angle measurements are used to measure adhesion energies of Cu and Ag layers on substrates of either SiO2 and Pa-n. Qualitative tape-test analysis indicates improved adhesion of these films with anneal and plasma treatment. Surface energy increase of parylene-n using oxygen plasma treatment is demonstrated using sessile water-drop method. The increase in adhesion for the Ag/Pa-n system is attributed to increased roughness and presence of carbonyl groups on the surface. The contact angle measurements are corrected to compensate for the effect of roughness. The adhesion energy for Ag/Pa-n system increases from 0.33 to 1.28 N/m with plasma treatment. Higher-surface energies of copper at room temperature attribute to higher-copper adhesion energy when compared to that of silver. (C) 2003 American Institute of Physics.