Silver localization on polyimide using microcontact printing and electroless metallization
Silver localization on polyimide using microcontact printing and electroless metallization
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DOI：
10.1016/j.apsusc.2014.04.108
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发表时间：
2014-07
影响因子：
6.7
通讯作者：
S. Gout;J. Coulm;D. Léonard;F. Bessueille
中科院分区：
文献类型：
--
作者：
S. Gout;J. Coulm;D. Léonard;F. Bessueille
银定位是通过结合表面处理（化学和等离子体）、微接触印刷（μCP）和无电金属沉积的分步工艺在聚酰亚胺Kapton®HN（PI）上实现的。开发这些方法是为了在微米和亚微米尺度下在柔性聚合物表面上获得银图案。使用相同的PDMS聚二甲基硅氧烷（PDMS）印模（正/负技术）获得银点的图案或相反的银层中的孔的图案。工艺基于相同的第一步，即用Ag（0）纳米颗粒、催化剂对PI表面进行官能化以进行银无电金属化。μCP步骤是基于十八烷基硫醇（CH 3（CH 2）17 SH; ODT）自组装单层（SAM）的局部钝化。这些分子局部印刷在连续的银存款上或Ag（0）催化纳米颗粒上。然后，化学蚀刻和/或无电沉积完成定位过程。讨论了银图案的几何形状和尺寸，突出了影响这些银图案的高分辨率（亚微米尺度）的主要参数。
Silver localization is obtained on polyimide Kapton®HN (PI) in step by step processes combining surface treatments (chemical and plasma), microcontact printing (μCP) and electroless metal deposition. There processes are developed in order to obtain silver patterns onto flexible polymer surfaces at the micro and sub-micro scale. Patterns of silver dots or, at the opposite, of holes in silver layer, were obtained using the same PDMS polydimethylsiloxane (PDMS) stamp (positive/negative technology). Processes are based on the same first step, i.e. the PI surface functionalization with Ag(0) nanoparticles, catalyst to silver electroless metallization. μCP step is based on a localized passivation with self-assembled monolayers (SAMs) of octadecanethiol (CH3(CH2)17SH; ODT). Those molecules are locally printed either on a continuous silver deposit or on the Ag(0) catalytic nanoparticles. Then, chemical etching and/or electroless deposition complete the localization process. Geometry and dimensions of silver patterns are discussed, highlighting the main parameters influencing high resolution (sub-micrometric scale) of these silver patterns.