Analytical thermal resistances model for eccentric heat source on rectangular plate with convective cooling at upper and lower surfaces
Analytical thermal resistances model for eccentric heat source on rectangular plate with convective cooling at upper and lower surfaces
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DOI：
10.1016/j.ijthermalsci.2011.06.011
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发表时间：
2011-11
影响因子：
4.5
通讯作者：
Xiaobing Luo;Zhangming Mao;Sheng Liu
中科院分区：
文献类型：
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作者：
Xiaobing Luo;Zhangming Mao;Sheng Liu
矩形板上的上下表面对流冷却热源是电子封装中常见的传热应用场合。为了寻求该问题的解析解，建立了基于热流分布的热阻网络模型。该模型用于计算热阻和预测热源的平均温度。利用COMSOL3.5商业软件进行了仿真，为模型的验证提供了参考。仿真结果与解析解的数据比较表明，该网络模型能够准确地计算出所讨论案例的热阻，最大相对误差为3.47%。
Heat sources on rectangular plate with convective cooling at both upper and lower surfaces are common heat transfer application case in electronic packaging. In this paper, in order to find the analytical solution for this problem, a thermal resistances network model was established based on heat flux flow distribution. The model was used to calculate thermal resistance and predict the mean temperature of the heat source. Simulations by commercial software COMSOL3.5 provided a reference for verification of the model. Data comparisons between simulation and analytical solution show that the network model is accurate to calculate the thermal resistance of the discussion cases and the maximum relative error is 3.47%.