A Wireless Stress Mapping System for Orthodontic Brackets Using CMOS Integrated Sensors
A Wireless Stress Mapping System for Orthodontic Brackets Using CMOS Integrated Sensors
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DOI：
10.1109/jssc.2013.2264619
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发表时间：
2013-09-01
影响因子：
5.4
通讯作者：
Manoli, Yiannos
中科院分区：
文献类型：
--
作者：
Kuhl, Matthias;Gieschke, Pascal;Manoli, Yiannos
介绍了一种用于“智能托槽”开发的无线应力测绘系统。该系统旨在监测正畸治疗过程中施加到单个牙齿上的力和力矩，这可能有助于提高治疗效果。它包括在0.35 μ m工艺中制造的应力映射芯片和通过在光刻胶掩模中电镀金产生的微线圈。24个基于晶体管的应力传感器用于测量面内剪切应力或面内法向应力的差异被策略性地分布在芯片区域上。传感器信号由可变增益差分放大器进行处理，并由10位SAR ADC进行数字化，在最高增益下实现低至11 kPa的分辨率。无线接口调节以13.56 MHz接收的能量，并通过负载调制发送数据。该系统的尺寸为2 x 2.5 x 0.73 mm（3），功耗为1.75 mW，为智能托槽的组装奠定了基础，成为正畸治疗中的创新工具。
A wireless stress mapping system for the development of "smart brackets" is presented. The system is designed for monitoring the forces and moments applied to individual teeth during orthodontic therapy which may contribute to improve treatment effectiveness. It comprises a stress mapping chip fabricated in a 0.35-mu m process and a micro coil produced by gold electroplating in a photoresist mask. Twenty-four transistor-based stress sensors for measuring either in-plane shear stress or the difference of in-plane normal stresses are strategically distributed over the chip area. The sensor signals are processed by a variable-gain differential difference amplifier and digitized by a 10-bit SAR ADC, enabling a resolution down to 11 kPa at highest gain. A wireless interface conditions the energy received at 13.56 MHz and transmits the data by load modulation. With dimensions of 2 x 2.5 x 0.73 mm(3) and a power consumption of 1.75 mW, the system lays the foundation for the assembly of smart brackets as innovative tools in orthodontic therapy.