Tuning etch selectivity of fused silica irradiated by femtosecond laser pulses by controlling polarization of the writing pulses
Tuning etch selectivity of fused silica irradiated by femtosecond laser pulses by controlling polarization of the writing pulses
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DOI：
10.1063/1.3555080
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发表时间：
2011-03-01
影响因子：
3.2
通讯作者：
Midorikawa, Katsumi
中科院分区：
文献类型：
--
作者：
Yu, Xiaoming;Liao, Yang;Midorikawa, Katsumi
本文报道了线偏振和圆偏振飞秒激光在宽脉冲能量范围内对熔融石英的化学刻蚀选择性的实验研究。得到了不同极化状态下的刻蚀速率与脉冲能量的关系，并将其分为三个不同的区域。观察到高脉冲能量区的刻蚀速率下降，并对其机理进行了讨论。使用圆偏振激光的优点是合理的，由于其提供3D各向同性蚀刻速率的独特能力。(C)2011年美国物理学会。[doi：10.1063/1.3555080]
We report on experimental study on chemical etch selectivity of fused silica irradiated by femtosecond laser with either linear or circular polarization in a wide range of pulse energies. The relationships between the etch rates and pulse energies are obtained for different polarization states, which can be divided into three different regions. A drop of the etch rate for high pulse energy region is observed and the underlying mechanism is discussed. The advantage of using circularly polarized laser is justified owing to its unique capability of providing a 3D isotropic etch rate. (C) 2011 American Institute of Physics. [doi:10.1063/1.3555080]