Rapid, On-Command Debonding of Stimuli-Responsive Cross-Linked Adhesives by Continuous, Sequential Quinone Methide Elimination Reactions
Rapid, On-Command Debonding of Stimuli-Responsive Cross-Linked Adhesives by Continuous, Sequential Quinone Methide Elimination Reactions
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DOI：
10.1002/anie.201506511
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发表时间：
2015-10-26
影响因子：
16.6
通讯作者：
Phillips, Scott T.
中科院分区：
文献类型：
--
作者：
Kim, Hyungwoo;Mohapatra, Hemakesh;Phillips, Scott T.
本发明描述了通过在聚（α-烯烃）基质内的聚（苄基醚）大分子交联剂的刺激诱导的头-尾连续解聚而从表面选择性脱粘的粘合剂。连续的头-尾解聚提供比使用小分子交联剂可以实现的更快的响应速率，以及对较低刺激浓度的响应。通过粘合剂保持在一起的玻璃的剪切应力值达到0.51 +/- 0.10MPa，而通过醌甲基化物中间体的信号诱导的解聚将剪切应力值降低到0.05 +/- 0.02MPa。改变宏观交联剂的长度改变了脱粘所需的时间，从而使得能够程序化地顺序释放玻璃复合材料中的特定层。
Adhesives that selectively debond from a surface by stimuli-induced head-to-tail continuous depolymerization of poly(benzyl ether) macro-cross-linkers within a poly(norbornene) matrix are described. Continuous head-to-tail depolymerization provides faster rates of response than can be achieved using a small-molecule cross-linker, as well as responses to lower stimulus concentrations. Shear-stress values for glass held together by the adhesive reach 0.51 +/- 0.10MPa, whereas signal-induced depolymerization via quinone methide intermediates reduces the shear stress values to 0.05 +/- 0.02MPa. Changing the length of the macro-cross-linkers alters the time required for debonding, and thus enables the programmed sequential release of specific layers in a glass composite material.