Cooling low-dimensional electron systems into the microkelvin regime.
Cooling low-dimensional electron systems into the microkelvin regime.
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DOI:
10.1038/s41467-022-28222-x
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发表时间:
2022-02-03
影响因子:
16.6
通讯作者:
Saunders J
中科院分区:
文献类型:
--
作者:
Levitin LV;van der Vliet H;Theisen T;Dimitriadis S;Lucas M;Corcoles AD;Nyéki J;Casey AJ;Creeth G;Farrer I;Ritchie DA;Nicholls JT;Saunders J
Two-dimensional electron gases (2DEGs) with high mobility, engineered in semiconductor heterostructures host a variety of ordered phases arising from strong correlations, which emerge at sufficiently low temperatures. The 2DEG can be further controlled by surface gates to create quasi-one dimensional systems, with potential spintronic applications. Here we address the long-standing challenge of cooling such electrons to below 1 mK, potentially important for identification of topological phases and spin correlated states. The 2DEG device was immersed in liquid 3He, cooled by the nuclear adiabatic demagnetization of copper. The temperature of the 2D electrons was inferred from the electronic noise in a gold wire, connected to the 2DEG by a metallic ohmic contact. With effective screening and filtering, we demonstrate a temperature of 0.9 ± 0.1 mK, with scope for significant further improvement. This platform is a key technological step, paving the way to observing new quantum phenomena, and developing new generations of nanoelectronic devices exploiting correlated electron states. Cooling electrons into the microkelvin temperature range is of interest both for practical purposes and fundamental studies, but current demonstrations are limited to small, specific devices. Here, the authors achieve sub-millikelvin temperatures in a large-area, two-dimensional electron gas.
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影响因子:
8.6
作者:
JAIN, JK
通讯作者:
JAIN, JK
影响因子:
1.6
作者:
Bluhm, Hendrik;Moler, Kathryn A.
通讯作者:
Moler, Kathryn A.
影响因子:
8.6
作者:
Braunecker, Bernd;Simon, Pascal
通讯作者:
Simon, Pascal
影响因子:
2.1
作者:
Batey, G.;Buehler, M.;Twin, A.
通讯作者:
Twin, A.
DOI:
10.1098/rsta.2015.0050
发表时间:
2016-03-28
影响因子:
5
作者:
Kirste, A.;Engert, J.
通讯作者:
Engert, J.