Experimental study on CPU cooling system of closed‐loop two‐phase thermosyphon
Experimental study on CPU cooling system of closed‐loop two‐phase thermosyphon
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DOI：
10.1002/htj.20057
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发表时间：
2005-05
影响因子：
1.7
通讯作者：
S. Gima;T. Nagata;Xing Zhang;M. Fujii
中科院分区：
文献类型：
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作者：
S. Gima;T. Nagata;Xing Zhang;M. Fujii
本文报道了一种采用闭环两相热虹吸管以 Fluorinert (FC-72) 为工作流体的笔记本电脑大功率 CPU 的间接冷却方法。实验装置由一个带有电加热器的蒸发器、一个冷凝器以及连接它们的软管组成。加热器和冷凝器分别充当笔记本电脑显示屏后面的高功率 CPU 和冷却板。蒸发器和冷凝器的外形尺寸分别为50mm×50mm×20mm和150mm×200mm×20mm。检查了蒸发器的四种可能的沸腾表面，即光滑表面（A 型）、粗糙表面、具有光滑板翅片和粗糙板翅片的表面（D 型）。 D型蒸发器表现出最高的性能，即与光滑表面蒸发器（A型）相比，它使蒸发器/加热器界面处的温度降低了约18%。 D 型蒸发器在最高热输入 Q = 30W 时将蒸发器/加热器界面与环境之间的温差保持在 55 K 左右。通过实验研究了热输入Q、热虹吸管中氟惰性液体F的体积量以及蒸发器类型对冷却系统传热特性的影响。 © 2005 Wiley periodicals, Inc. Heat Trans Asian Res，34(3): 147–159，2005；在线发表于 Wiley InterScience (www.interscience.wiley.com)。 DOI 10.1002/htj.20057
This paper reports on an indirect cooling method of high-power CPU of notebook computers using a closed-loop two-phase thermosyphon with Fluorinert (FC-72) as the working fluid. The experimental setup consists of an evaporator with an electric heater, a condenser, and flexible tube connecting them. The heater and condenser act as a high-power CPU and a cooling plate located behind the display of a notebook computer, respectively. The evaporator and the condenser have the outer dimensions of 50mm × 50mm × 20mm and 150mm × 200mm × 20mm, respectively. Four possible boiling surfaces of an evaporator were examined, i.e., a smooth surface (Type A), rough one, ones with smooth plate fins and rough plate fins (Type D). Type D evaporator shows the highest performance, i.e., it reduces the temperature at the evaporator/heater interface by about 18% in comparison with that of the smooth surface evaporator (Type A). Type D evaporator keeps the temperature difference between the evaporator/heater interface and the ambient to be around 55 K at the highest heat input Q = 30W. The effects of the heat input Q, the volumetric amount of Fluorinert liquid F in the thermosyphon, and the evaporator type on the heat transfer characteristics of the cooling system were examined experimentally. © 2005 Wiley Periodicals, Inc. Heat Trans Asian Res, 34(3): 147–159, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20057