Analytical models of adhesively bonded joints-Part I: Literature survey
Analytical models of adhesively bonded joints-Part I: Literature survey
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DOI：
10.1016/j.ijadhadh.2008.06.005
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发表时间：
2009-04-01
影响因子：
3.4
通讯作者：
Spelt, J. K.
中科院分区：
文献类型：
--
作者：
da Silva, Lucas F. M.;das Neves, Paulo J. C.;Spelt, J. K.
对现有的单搭接和双搭接接头的分析模型进行了广泛的文献综述，以帮助设计人员为特定应用选择正确的模型。文献回顾表明，几乎所有的分析模型的粘接搭接接头是二维的。这通常是足够的，因为在宽度方向上的应力显著低于在加载方向上的应力。大多数的分析都是线弹性的被粘物和胶粘剂，因为包括材料的非线性，使解决方案过于复杂。随着胶粘剂和被粘物中应力分量的复杂程度和数量的增加，初始分析问题必须用数值方法求解。主要分析的摘要，指出适用条件和考虑的应力分量。一个比较研究的各种模型越来越复杂，以及如何强度预测的基础上，这些模型与实验数据进行比较，在一个附带的文件。(C)2008爱思唯尔有限公司保留所有权利。
An extensive literature review on existing analytical models for both single and double-lap joints has been made to assist the designer to choose the right model for a particular application. The literature review shows that almost all analytical models for adhesively bonded lap joints are two-dimensional. This is generally sufficient because the stresses in the width direction are significantly lower than in the direction of the loading. Most of the analyses are linear elastic for both adherends and adhesive because the inclusion of material non-linearity renders the solution too complex. As the degree of complexity and the number of stress components in the adhesive and the adherends increase, the initial analytical problem must be solved numerically. A summary of the main analyses is presented indicating the conditions of applicability and the stress components considered. A comparative study of various models of increasing complexity and how strength predictions based on these models compare with experimental data is presented in an accompanying paper. (C) 2008 Elsevier Ltd. All rights reserved.