An in-plane high-sensitivity, low-noise micro-g silicon accelerometer with CMOS readout circuitry
An in-plane high-sensitivity, low-noise micro-g silicon accelerometer with CMOS readout circuitry
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DOI:
10.1109/memsys.2003.1189787
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发表时间:
2003-04
影响因子:
2.7
通讯作者:
Junseok Chae;H. Kulah;Khalil Najafi
中科院分区:
文献类型:
--
作者:
Junseok Chae;H. Kulah;Khalil Najafi
A high-sensitivity, low-noise in-plane (lateral) capacitive silicon microaccelerometer utilizing a combined surface and bulk micromachining technology is reported. The accelerometer utilizes a 0.5-mm-thick, 2.4/spl times/1.0 mm/sup 2/ proof-mass and high aspect-ratio vertical polysilicon sensing electrodes fabricated using a trench refill process. The electrodes are separated from the proof-mass by a 1.1-/spl mu/m sensing gap formed using a sacrificial oxide layer. The measured device sensitivity is 5.6 pF/g. A CMOS readout circuit utilizing a switched-capacitor front-end /spl Sigma/-/spl Delta/ modulator operating at 1 MHz with chopper stabilization and correlated double sampling technique, can resolve a capacitance of 10 aF over a dynamic range of 120 dB in a 1 Hz BW. The measured input referred noise floor of the accelerometer-CMOS interface circuit is 1.6/spl mu/g//spl radic/Hz in atmosphere.