Change in Electrical Resistivity in Nickel Processed by Accumulative Roll Bonding
Change in Electrical Resistivity in Nickel Processed by Accumulative Roll Bonding
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DOI：
10.2320/matertrans.mt-m2021063
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发表时间：
2021-01-01
影响因子：
1.2
通讯作者：
Fujii, Toshiyuki
中科院分区：
文献类型：
--
作者：
Miyajima, Yoji;Ueda, Taro;Fujii, Toshiyuki
纯镍进行累积轧制结合（ARB），在77 K下测量的电阻率的变化是约2.2 N Ω m后8 ARB周期。电阻率的变化是基于微观结构参数估计的，例如，在8次ARB循环之后，位错密度约为3 × 10（14）m（-2），晶界密度约为8 μ m（-1）。这些值分别使用场发射扫描电子显微镜中的X射线衍射和电子背散射衍射进行评价。电阻率的变化与上述显微结构参数有关。
Pure nickel was processed by accumulative roll bonding (ARB), and the change in electrical resistivity measured at 77 K was about 2.2 n Omega m after 8 ARB cycles. The change in electrical resistivity was estimated based on the microstructural parameters, such as, dislocation density of about 3 x 10(14)m(-2) and density of grain boundaries of about 8 Mm(-1) after 8 ARB cycles. Those values were evaluated using X-ray diffraction and electron backscattering diffraction in a field emission-scanning electron microscope, respectively. The change in the electrical resistivity was associated with the above-mentioned microstructural parameters.