Scanning white light interferometry in quality control of single-point tape automated bonding
Scanning white light interferometry in quality control of single-point tape automated bonding
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扫描白光干涉测量在单点胶带自动粘合质量控制中的应用
DOI：
10.1117/12.567064
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
Mathias Osterberg
中科院分区：
文献类型：
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作者：
H. Seppanen;I. Kassamakov;M. Oinonen;Edward Hæggstrom;J. Aaltonen;Z. Radivojevic;Mathias Osterberg
我们报告使用扫描白色光干涉仪（SWLI）的质量控制的铝铅单点胶带自动键合（spTAB）。采用spTAB工艺将12 μm厚聚酰亚胺层上的14 μm厚、42 μm宽的铝引线连接到微芯片上。三种不同的键合工艺参数，以最大限度地提高拉力：键合力，超声波功率和超声波时间。使用定制的SWLI测量粘合的形貌，以找到与拉伸粘合力相关的特征。该力通过拉力试验以破坏性方式获得。通过将键合高度保持在3±1.5 μm范围内，获得了具有超过54 mN的可接受张力的键合。这通过单独的确认测量进行了验证，其中记录了符合高度要求的粘合拉力。
We report on using a Scanning White Light Interferometer (SWLI) for quality control of aluminum lead single-point Tape Automated Bonding (spTAB). A spTAB process was used to connect 14 μm thick, 42 μm wide aluminum leads on a 12 μm thick polyimide layer to a micro chip. Three different bonding process parameters were varied in order to maximize the pull force: bond force, ultrasonic power, and ultrasonic time. A custom built SWLI was used to measure the topography of the bonds in order to find features that correlate with the tensile bond force. This force was obtained in a destructive way by a pull test. By keeping the bond height within 3±1.5 μm, bonds with acceptable tensile forces in excess of 54 mN were obtained. This was verified by a separate validation measurement where the pull force of bonds complying with the height requirement was recorded.