Development of Particle Assembling Technology by Using Micro-Electrophoretic Deposition Process
Development of Particle Assembling Technology by Using Micro-Electrophoretic Deposition Process
复制标题
利用微电泳沉积工艺开发粒子组装技术
DOI：
10.4028/www.scientific.net/kem.248.195
复制
发表时间：
2003
期刊：
影响因子：
--
通讯作者：
K. Kanamura
中科院分区：
文献类型：
--
作者：
Jun Ichi Hamagami;K. Hasegawa;K. Kanamura
本文报道了一种利用微电极的电泳沉积技术，即μ-EPD过程，即利用局部电场进行微粒组装的新技术。采用粒径均匀的聚苯乙烯（PS）或二氧化硅球形粒子作为分散粒子，在悬浮液中进行分散。利用这种微-EPD工艺可以在镀有氧化铟锡艾德的玻璃基片上成功地在所需位置上形成微米级的点及其图形。通过优化μ-EPD工艺参数，得到了由三维有序球形颗粒组成的点。
A novel particle assembling technique using a local electric fie ld has been investigated by electrophoretic deposition technique using a very small counter ele ct od (microelectrode), this is so-called μ-EPD process. Polystyrene (PS) or silica spherical particle s with uniform diameter were used as a dispersed particle in a suspension. A micrometersiz dots and its patterning can be successfully formed onto a desired position of an indium-tin oxide-coat ed glass substrate by using this μ-EPD process. By optimizing the μ-EPD process parameter, the obtained dot consisted of three-dimensionally ordered spherical particles.