Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE: "Numerical Analysis of Wire Bonding-Effect of Pad Thickness on Interfacial Defmation Behaviors-" Proceeding of 4th Symposium on "Microjoining and Assembly Technology in Electronics. Vol.4. 73-78 (1998)
Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE: "Numerical Analysis of Wire Bonding-Effect of Pad Thickness on Interfacial Defmation Behaviors-" Proceeding of 4th Symposium on "Microjoining and Assembly Technology in Electronics. Vol.4. 73-78 (1998)
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Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE：“引线键合的数值分析-焊盘厚度对界面变形行为的影响-”第四届“电子微连接和组装技术研讨会”论文集。Vol.4. 73-78 (1998)
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