Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins
Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins
复制标题
嵌入纳米级孪晶的块状纳米晶铜的断裂韧性增强
DOI：
10.1016/j.scriptamat.2008.12.012
复制
发表时间：
2009-04-01
影响因子：
6
通讯作者：
Lu, K.
中科院分区：
文献类型：
--
作者：
Qin, E. W.;Lu, L.;Lu, K.
我们报道了一种提高断裂韧性的大块铜样品通过动态塑性变形处理与纳米晶粒和嵌入纳米孪晶束的复合显微结构。断裂韧性的提高主要是由于嵌入的孪晶束产生了细长的深断裂韧窝，消耗了高得多的断裂能。(C)2008 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformation with a composite microstructure of nanoscale grains and embedded nanoscale twin bundles. The improvement in fracture toughness is mainly due to the embedded twin bundles which generate elongated deep fracture dimples that consume much higher fracture energy. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.