A quantitative analysis of Scratch Drive Actuator using buckling motion
A quantitative analysis of Scratch Drive Actuator using buckling motion
复制标题
使用屈曲运动对划痕驱动执行器进行定量分析
DOI：
10.1109/memsys.1995.472603
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发表时间：
1995
期刊：
影响因子：
--
通讯作者：
H. Fujita
中科院分区：
文献类型：
--
作者：
T. Akiyama;H. Fujita
本文提出了一种表面微加工多晶硅驱动器，它采用静电驱动的划痕驱动器（SDA）产生的力，可以移动外部对象。该微驱动器由SDA、连接框架和屈曲梁组成。使用这种结构，SDA产生的力作为施加的脉冲峰值电压的函数进行了测量。在+112 V脉冲峰值电压下，典型的产生力为63 pN。提出了从微致动器获得物理功的间接和直接方法。通过直接方法，致动器可以在从晶片表面约100 μ m的高度处提起1 mg重量。这项工作的总能量为1 nJ。
This paper presents a surface micromachined polysilicon actuator which employs an electrostatic driven Scratch Drive Actuator (SDA) to generate a force that can move an extemal object. The micro actuator consists of the SDA, a link frame and a buckling beam. Using this structure, generated forces of the SDA as a function of applied pulse peak voltages were measured. A typical generated force was 63 pN at +112 V pulse peak voltage. Indirect and direct methods of obtaining physical work from the micro actuator are presented. The actuator could lift 1 mg weight up at a height of about 100 pm from the wafer surface by the direct method. The total energy of this work was 1 nJ.