Accelerated testing and finite element analysis of PBGA under multiple environmental loadings
Accelerated testing and finite element analysis of PBGA under multiple environmental loadings
复制标题
多种环境载荷下PBGA的加速测试和有限元分析
DOI：
10.1109/beprl.2004.1308157
复制
发表时间：
2004
期刊：
影响因子：
--
通讯作者：
M. Pecht
中科院分区：
文献类型：
--
作者：
H. Qi;S. Ganesan;M. Osterman;M. Pecht
为了研究塑料球栅阵列（PBGA）封装在航空航天应用中的长期可靠性，对未填充和未填充的PBGA封装在多种环境载荷下进行了板级加速试验。本文讨论了焊点可靠性的测试结果和影响。通过对试验样品的失效分析，确定了失效模式和部位。为了更好地了解PBGA在循环热负荷环境下的热机械行为，还开发了非底部填充和底部填充封装的三维有限元模型，并用于预测失效时间。
To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace applications, accelerated tests were conducted to non-underfilled and underfilled packages under multiple environmental loadings at board level. This paper discusses the test results and the underfill effect on solder joint reliability. Failure modes and sites were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGAs under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure.