Drilling technology for high-thick copper
Drilling technology for high-thick copper
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发表时间：
2011
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通讯作者：
Lu Wen-w
中科院分区：
文献类型：
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作者：
Lu Wen-w
With the development of electronic technology,the density of chips and functional components are increasing,for this reason,narrowing the line width will become an inevitable development trend of PCB design.In order to improve the current carrying capacity of the line,we have to increase the width of conductors——copper thickness.For heavy copper PCB,defects like inner layer copper peeled off,hole wall roughness and nail heads in drilling process are often cause to scrap.This paper analyses the factors causing to inner layer copper peeled off,hole wall roughness,nail heads of heavy copper PCB,finds out the main factors and vertify,then got the most suitable types of drill bits and production parameters for heavy copper boards(total copper thickness ≥30 oz),solved the difficulty(high defect rate) in drilling process of heavy copper boards effectively.
