Failure mechanism of anisotropic conductive adhesive interconnections in flip chip ICs on flexible substrates
Failure mechanism of anisotropic conductive adhesive interconnections in flip chip ICs on flexible substrates
复制标题
柔性基板上倒装芯片各向异性导电胶互连的失效机制
DOI：
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发表时间：
2004
影响因子：
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通讯作者：
J. D. de Vries
中科院分区：
文献类型：
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作者：
J. D. de Vries
在这项工作中，我们研究了如何通过不同的环境条件下的影响的倒装芯片集成电路与间距为200和150/SPL MU/M的导电粘合剂互连的耐久性能。这是通过比较离线和在线控制测量来实现的，离线和在线控制测量用于监测温度-湿度和温度循环应力测试中的电阻。从电阻随时间的逐渐退化和失效分析中，可以看出，周期性的吸湿和脱湿形成了这种类型组件中更重要的失效机制之一。
In this work we study how the endurance performance of electrically conductive adhesive interconnections of flip chip integrated circuits with a pitch of 200 and 150/spl mu/m on flexible substrates is affected by varying environmental conditions. This is accomplished by comparison of offline and online control measurements that are carried out to monitor the electrical resistance in temperature-humidity and temperature cycling stress tests. From the gradual degradation of the resistance with time and the failure analysis, it is conjectured that periodic absorption and desorption of moisture forms one of the more important failure mechanisms in this type of assembly.