Design, modeling, microfabrication and characterization of novel micro thermal conductivity detector
Design, modeling, microfabrication and characterization of novel micro thermal conductivity detector
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新型微型热导探测器的设计、建模、微加工和表征
DOI：
10.1016/j.snb.2011.09.006
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发表时间：
2011-12-15
影响因子：
8.4
通讯作者：
Li, Hui
中科院分区：
文献类型：
--
作者：
Sun, Jianhai;Cui, Dafu;Li, Hui
本文描述了新型微型热导探测器 (mu TCD) 的设计、建模、制造和表征。为了最大限度地提高检测响应，设计了高度隔离的热敏电阻和四丝惠斯通电桥电路。为了提高可靠性，这些热敏电阻由硅层扩散、氧化硅层和氮化硅层形成的多层结构梁支撑。采用聚二甲基硅氧烷（PDMS）膜代替玻璃在室温下密封μ TCD，密封效果良好。此外，这种方法可以避免热敏电阻在键合过程中受高温影响而产生的阻值变化。从耐压和气密性测试来看，μTCD可以承受0.5MPa的压力，不会出现泄漏和损坏芯片的情况。然后使用μ TCD 检测CH(4)，检测响应为500 ppm，响应时间短为30 s。 (C) 2011 Elsevier B.V. 保留所有权利。
This paper describes the design, modeling, fabrication, and characterization of a novel micro thermal conductivity detector (mu TCD). To maximize the detection response, highly isolated thermistors and a four-filament Wheatstone bridge circuit were designed. To enhance the reliability, these thermistors were supported by a multi-layer structure beam formed by a diffusion of silicon layer, a silicon oxidation layer, and a silicon nitride layer. A polydimethylsiloxane (PDMS) membrane instead of a glass was used to seal the mu TCD at the room temperature with a good sealing effect. Moreover this method could avoid the resistance variation of thermistors affected by the high temperature during the bonding step. From the pressure and the hermetic tests, the mu TCD could withstand 0.5 MPa pressure without leakage and destroying the chip. Then the mu TCD was used to detect the CH(4) with a detection response of 500 ppm and a short response time of 30 s. (C) 2011 Elsevier B.V. All rights reserved.