Flexible Electronics: A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide (Adv. Funct. Mater. 6/2018)
Flexible Electronics: A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide (Adv. Funct. Mater. 6/2018)
复制标题
柔性电子产品：一种用于在聚醚酰亚胺上选择性电镀 2D 和 3D 微电路的快速光图案化方法（Adv. Funct. Mater. 6/2018）
DOI：
10.1002/adfm.201870041
复制
发表时间：
2018
影响因子：
19
通讯作者：
Marques-Hueso J
中科院分区：
文献类型：
--
作者：
Marques-Hueso J
在文章编号1704451中，Jose Marques‐Hueso及其同事提出了一种快速电镀方法，该方法允许在聚醚酰亚胺上选择性电镀2D和3D微电路。小至18 μm的导电铜轨道可通过在基板上局部光诱导合成银纳米颗粒来实现。该方法对柔性聚醚酰亚胺薄膜和3D打印基板的适用性显示出电子制造的前景。
In article number 1704451, Jose Marques‐Hueso and co‐workers present a rapid photopatterning method that allows for selective plating of 2D and 3D microcircuity on polyetherimide. Conductive copper tracks as small as 18 μm are accessible by local light‐induced synthesis of silver nanoparticles on the substrate. Applicability of the method for flexible polytherimide films and 3D‐printed substrates shows promise for electronics manufacturing.