Collapse of stamps for soft lithography due to interfacial adhesion
Collapse of stamps for soft lithography due to interfacial adhesion
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DOI：
10.1063/1.1900303
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发表时间：
2005-04-11
影响因子：
4
通讯作者：
Fulton, JM
中科院分区：
文献类型：
--
作者：
Hsia, KJ;Huang, Y;Fulton, JM
通过实验测量和理论建模，研究了软光刻中用于图形转移的弹性元件的塌陷问题。目的是确定这种崩溃的驱动力。两个潜在的驱动力，邮票的自重和界面粘附力，进行了研究。考虑了一种理想化的周期矩形槽和平凸模结构。实验观察表明，无论重力是促进还是抑制这种塌陷，凹槽塌陷都会发生，这表明自重不是驱动力。另一方面，模型预测的基础上的假设，界面粘附力的驱动力表现出良好的协议与实验测得的崩溃行为。界面粘附能也通过匹配模型中的粘附参数与实验数据进行评估。(C)2005年美国物理学会。
Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modehng. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data. (C) 2005 American Institute of Physics.