Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma
Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma
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DOI：
10.4028/www.scientific.net/kem.523-524.262
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发表时间：
2012-11
期刊：
影响因子：
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通讯作者：
Kento Ooka;Y. Yamamoto;Y. Hara;N. Zettsu;K. Yamamura
中科院分区：
文献类型：
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作者：
Kento Ooka;Y. Yamamoto;Y. Hara;N. Zettsu;K. Yamamura
我们通过常压等离子体与液相自组装相结合的方法制备了高附着力的含氟聚合物/铜界面。然而，大气压等离子体技术也存在一些缺点，如局部等离子体导致的加工面积小和气体温度高。中压等离子体工艺与大气压等离子体系统相比具有一些优点。可用于聚合物材料表面处理的大等离子体体积和低气体温度在中压下比在大气压下更容易获得，这可以导致更高的总体生产率。本文研究了采用中压氦等离子体辐照和胺化丙烯酸聚合物接枝相结合的方法对聚（四氟乙烯-全氟丙基乙烯基醚）（PFA）表面化学镀铜的结合强度。处理后的PFA薄膜上形成的镀铜膜的90°剥离测试结果显示，附着强度为0.44 N/mm，且表面粗糙度没有增加。
We demonstrated high adhesive fluoropolymer/copper interface through combination of atmospheric pressure plasma with liquid phase self-assembly. However, there are some disadvantages in atmospheric pressure plasma technique, such as small processing area due to the localized plasma and high gas temperature. Medium pressure plasma process has some advantages over atmospheric pressure plasma systems. A large plasma volume and low gas temperature, available for surface treatment of polymer material, can be easier obtained at medium pressure than at atmospheric pressure, which can result in a higher overall productivity. In this paper, we investigated the adhesion strength of electroless copper plated layer formed on poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surface modified by combination of medium pressure helium plasma irradiation and aminated acrylic polymer grafting. The 90° peel test result for copper plating film formed on the treated PFA films showed the adhesion strength of 0.44 N/mm without increasing the surface roughness.