Perturbation Theory in Dierential Homological Algebra II
Perturbation Theory in Dierential Homological Algebra II
复制标题
微分同调代数中的微扰理论 II
DOI：
10.1215/ijm/1255987784
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发表时间：
1989
影响因子：
5.4
通讯作者：
J. Stasheff
中科院分区：
文献类型：
--
作者：
V. Gugenheim;L. Lambe;J. Stasheff
一种多层布线基板，由有机电介质层和布线层组成，其中设置有支撑大规模集成电路芯片和焊盘的布线层。为了防止当通过热压接合将来自集成电路芯片的导线附接到接合焊盘时对布线层的损坏，在布线层和接合焊盘之间插入金属层。
A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.