The contrast mechanism of bond defects with the scanning acoustic microscopy
The contrast mechanism of bond defects with the scanning acoustic microscopy
复制标题
扫描声学显微镜观察键合缺陷的对比机制
DOI：
10.1121/1.423859
复制
发表时间：
1998
影响因子：
2.4
通讯作者：
Lugen Wang
中科院分区：
文献类型：
--
作者：
Lugen Wang
本文讨论了扫描声学显微镜在检测具有粘结缺陷的层状固体时的响应的理论问题。利用传递矩阵法和弹性边界条件，在波数域内给出了层状固体中界面缺陷引起的弹性波散射问题的解。将该散射解与扫描声学显微镜模型相结合，计算了显微镜的响应。结果表明，在所有离焦范围内，声学显微镜的响应对键的顺应性都很敏感。然而，剪切粘结柔度仅在较大离焦时才对响应产生影响。显微响应和键合顺应性之间的关系很大程度上取决于缺陷宽度、形状以及层和衬底的材料特性。
This paper discusses the theoretical aspects of the scanning acoustic microscopy response when used to inspect layered solids with bond defects. By using the transfer matrix method and spring boundary conditions, the solution of elastic wave scattering by an interface weakness in a layered solid has been presented in the wave number domain. The microscopy response has been calculated by combining this scattering solution with the scanning acoustic microscopy model. The results show that the acoustic microscopy response is sensitive to normal bond compliance in all defocus range. However, the shear bond compliance has influence on the response only at large defocus. The relations between the microscopy response and bond compliances significantly depend on the defect width, shape, and the material properties of the layer and substrate.