Cu-based composite inks of a self-reductive Cu complex with Cu flakes for the production of conductive Cu films on cellulose paper
Cu-based composite inks of a self-reductive Cu complex with Cu flakes for the production of conductive Cu films on cellulose paper
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DOI：
10.1016/j.matchemphys.2017.05.017
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发表时间：
2017-08-15
影响因子：
4.6
通讯作者：
Kawasaki, Hideya
中科院分区：
文献类型：
--
作者：
Kawaguchi, Yuki;Hotta, Yusuke;Kawasaki, Hideya
纸基电子产品由于其廉价、可再生和环保的基材而引起了人们的极大关注。在这项研究中，铜基复合油墨组成的铜基金属有机物分解（MOD）油墨和铜薄片制备为前体，以获得未经处理的纤维素纸上的导电铜膜。还没有探索铜基MOD油墨用于在纤维素纸上生产导电Cu膜，因为纸的性质，例如高孔隙率、高渗透性和表面粗糙度，不利于获得连续的导电Cu膜。然而，使用我们的方法，我们已经获得了铜膜的纸张上的电阻率是类似的聚酰亚胺或玻璃基板上的膜的电阻率的10倍以下。重要的是，在纸上的铜膜表现出更好的机械阻力比聚酰亚胺基板上，没有任何预处理的纸张表面。(C)2017爱思唯尔B.V.保留所有权利。
Paper-based electronics have been attracting significant attention because of their inexpensive, renewable, and eco-friendly substrates. In this study, Cu-based composite inks composed of a copper-based metal-organic decomposition (MOD) ink and Cu flakes were prepared as precursors to obtain conductive Cu films on untreated cellulose paper. Copper-based MOD inks have not been explored for the production of conductive Cu films on cellulose paper because the properties of the paper, such as high porosity, high permeability, and surface roughness, are not favorable to obtain continuous conductive Cu films. However, using our method, we have obtained Cu films on paper with resistivities that are similar to 10 times lower than those of films on polyimide or glass substrates. Importantly, the Cu films on paper exhibited better mechanical resistance than those on a polyimide substrate, without any pre-treatment of the paper surface. (C) 2017 Elsevier B.V. All rights reserved.