Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37
Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37
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DOI：
10.1007/s10854-011-0435-5
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发表时间：
2012-02
期刊：
影响因子：
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通讯作者：
B. Medgyes;B. Illés;G. Harsányi
中科院分区：
文献类型：
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作者：
B. Medgyes;B. Illés;G. Harsányi
将含铅表面处理的电化学迁移（ECM）行为与电子制造中应用的其他表面处理进行了比较。所研究的表面处理分别为裸铜（bCu）、浸锡（iSn）、浸银（iAg）和热风调平法（HASL）制备的Sn63Pb。通过计算平均失效时间（MTTF）的水滴试验和对树突组成的研究对结果进行了评价。结果显示，与之前公布的ECM排名相比，裸铜和HASL存在一些矛盾（Harsányi和Inzelt in Microelectron Reliab 41:22 29 - 237, 2001; Yu et al. J Mater Sci: Mater Electron 17(3): 229-241, 2006）。铜和HASL可以根据调查的技术情况改变它们在ECM排名中的位置。这种影响可由铅合金的组成（是否共晶）、金属氢氧化物的溶解度参数引起；铜表面的氧化状态等。本文还对迁移模型的进一步理论解释和必要的微调进行了讨论。
The Electrochemical Migration (ECM) behaviour of leaded surface finishes was compared to other surface finishes that are applied in the electronics manufacturing. The studied surface finishes were as follows: bare copper (bCu), immersion tin (iSn), immersion silver (iAg) and Sn63Pb prepared by HASL (Hot Air Solder Leveling). The results were evaluated by Water drop test with the calculation of the Mean Time to Failure (MTTF) and by the investigation of the composition of the dendrites. The results have shown some contradictions relating bare copper and HASL compared to the ECM ranking published previously (Harsányi and Inzelt in Microelectron Reliab 41:229–237, 2001; Yu et al. in J Mater Sci: Mater Electron 17(3):229–241, 2006). The copper and the HASL can change their places in the ECM ranking depending on the technological circumstances of the investigations. This impact can be caused by the composition of lead alloys (eutectic or not), the solubility parameters of the metal hydroxides; the oxidation state of the copper surface, etc. Further and theoretical explanations and the necessary fine adjustment of the migration models are discussed in the paper.