Vertical signal transmission by non-contact technology application for 3DIC
Vertical signal transmission by non-contact technology application for 3DIC
复制标题
3DIC非接触技术垂直信号传输
DOI：
10.1109/apmc.2013.6694946
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
Ming
中科院分区：
文献类型：
--
作者：
Jun;Ren;Wen;S. Wu;Cheng;Ming
为了解决3D-IC中的工艺和成本问题，提出了一种新型的非接触式耦合回路信号传输方法。在本研究中，我们设计了宽带、重复性好、方向性好和低损耗的耦合回路，用于3DIC应用中不同芯片或IC之间的信号传输，并建立了高达10 GHz的物理模型，利用耦合效应和回路效应恢复信号辐射。通过这种方法，TSV的整体信号传输可以与非接触技术相同。人们可以用这种设计来取代TSV技术在未来。
In order to solve the problem of process and cost in 3D-IC, novel non-contact signal transmission with coupling loops have been presented. In this study, we design the broadband, well reproducibility, well directivity and low loss coupling loops to transmit signal between different chips or ICs in 3DIC application, and establishing physical model up to 10GHz with coupling effect and loop effect to restore the signal radiation. By this method, the overall signal transmission of TSV can be the same as the non-contact technology. People can use this design to replace the TSV technology in the future.