Packaging of Photonic Integrated Circuit Based High-Speed Coherent Transmitter Module
Packaging of Photonic Integrated Circuit Based High-Speed Coherent Transmitter Module
复制标题
基于光子集成电路的高速相干发射机模块的封装
DOI：
10.1109/ectc.2016.166
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
G. Charlet
中科院分区：
文献类型：
--
作者：
S. Bernabé;B. Blampey;A. Myko;B. Charbonnier;K. Frigui;S. Bila;A. Mottet;J. Hauden;S. Jillard;B. Frigui;G. Duan;X. Pommarede;G. Charlet
Achieving an aggregated data rate of 100 Gbps and beyond is a must for all next generation optoelectronic modules, from very short reach optical links to long haul telecommunications links. Silicon Photonics Integrated Circuits allow to integrate various optical functions (modulators, fiber couplers, phase shifters, splitters, a. s. o) in order to build complex circuits on a single chip, enabling advanced modulation formats to be implemented. This paper presents the building blocks needed to achieve coherent transmitters using Silicon Photonics based circuits. The basic device that is evaluated is a BPSK transmitter. We focus on the circuit design and fabrication, and also on the complementary development related to the packaging design and assembly of the circuit, including signal integrity and fiber pigtailing.
